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Is there Lead in your Lead Free Solder Pot?
The IPC J-STD-001G Directive maintains that Lead content of circuit boards should not exceed 0.1% by weight of the alloy being used. Cadmium should not exceed .005% under this same directive. Although you may fill your solder pot with "virgin" material in the outset of your manufacturing process, solder can quickly collect "contaminants" that can cause soldering defects, degrade your process quality and put you in danger of non compliance with the IPC Standard. Read more from our Blog...
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