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FLEX Paste | Wire | Bar Test JSTD-006

Product Information

Test your OEM Wire Solder manufacturers quality and purity standards. Send your un-molten bar to our lab for analysis.

You will receive Solder Analysis Package with the number of Solder Sample Collection Kits that you have ordered. Complete and mail our solder collection envelope when you believe it is time to test your solder. We will test, prepare, and email your report to you. This report will compare measurements of the solder sample against industry standards IPC- J-STD-006C. 

Features: FLEXibility in when and how you perform manufacturer benchmark testing.

Solder Analysis Package for J-STD006 testing will be shipped to you.
Each Flex J-STD-006 Envelope Kit Includes:Solder Sample Information Card
Instructions on how much material we will require for this test.
A return addressed envelope for you to send us your sample.
Your report will be emailed to you within 48 hours of receipt of your sample.
Enhanced data analysis will provide a "go / no go" determination for your solder pot
*** Please Note: SolderLab no longer tests High Lead alloys. High Lead alloys are considered any solder alloy with a percentage of greater than 50% lead.


FLEX Paste | Wire | Bar Test JSTD-006

Acceptable alloys for test are those with less than 50% lead by weight.

Per Test / Item Price

Click here for which alloys we test

Acceptable alloys for test are those with less than 50% lead by weight.
  • Sn60Pb40
  • Sn63Pb37
  • Sn96.5Ag3.0Cu0.5
  • Sn100C all variants
  • K100LD